imr introspective market research

  The Wafer Grinder will change significantly from the previous year. Over the next five years, will register a CAGR in terms of revenue, and the global market size will reach USD in millions by 2028.   A wafer grinder is a machine that uses rotating blades to shear off the edges of semiconductor or other materials, such as silicon, at a high speed. This sort of tool is most commonly used to remove overlaps from integrated circuits and optical surfaces, although it can also be used to etch glass substrates. Photolithography systems and selective laser melting (SLM) equipment are two examples. A surface grinder removes material from the top of a workpiece, usually industrial items. It grinds down machined surfaces on any type of metal or plastic using revolving abrasive discs (called wheels) and stationary workpieces. This tool is commonly used in automotive manufacture to smooth off uneven edges at the end of an air intake manifold, such as after two sections have been weld...